PCB design - high-speed - GUIDE SERIES

Layout Editor Setup and Basic Configuration

Learn how to configure KiCad’s layout editor, set up the board stack-up, and define manufacturing-ready design rules for your PCB.

Before reading further, you can watch the companion video, where I walk through configuring the KiCad PCB editor for the LattePanda Mu Carrier. The video explains how to import reference design settings, adjust the layer stack-up, and prepare design rules that will later be validated with a manufacturer’s impedance calculator.

Introduction

Setting up the PCB layout editor correctly is one of the most important steps in preparing for board routing.
In this guide, we use the LattePanda Mu Carrier reference design as a foundation to configure the physical stack-up, layer naming, clearances, vias, and tuning parameters.
This ensures that when we begin routing the high-speed interfaces later, all rules match realistic fabrication limits and high-speed performance requirements.

Setting Up the Stack-Up and Layers

Begin by opening the Board Setup dialog in KiCad. You’ll configure the physical stack-up and assign roles to each copper layer.

The LattePanda Mu Carrier uses a four-layer PCB structure. The standard layer arrangement, from top to bottom, is:

Four-Layer Stack-Up for the LattePanda Mu Carrier
Layer Function Notes
Top Copper (Front) Signal Used for high-speed routing such as USB 3.0 and HDMI.
Inner Layer 1 Ground Plane (GND) Provides a solid return path for all high-speed signals.
Inner Layer 2 Power Plane (VCC) Carries 3.3 V, 5 V, and other power nets.
Bottom Copper (Back) Signal Used for slower signals and complementary routing paths.

Rename the inner layers for clarity (e.g., In1_GND and In2_PWR) so that the board setup dialog clearly reflects their intended purpose. This change is only cosmetic but helps maintain readability and organization throughout the design process.

Transferring Reference Design Parameters

With the physical stack-up defined, copy key parameters from the LattePanda reference design into your new project.
These values include layer thicknesses, dielectric constants, and preliminary impedance control settings.
Although they come from a working design, they must later be recalculated using your PCB manufacturer’s impedance and stack-up calculator.

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Different manufacturers use different materials, copper weights, and etching tolerances, all of which affect the final impedance of traces.
Therefore, treat the reference values as starting points only. The final impedance values will be calculated and verified in a later step using the NextPCB online calculator or a similar manufacturer-provided tool.

Setting Up Design Rules

Next, configure your Design Rules to ensure the layout adheres to practical fabrication limits.
This includes clearance, track width, via size, hole spacing, and thermal relief parameters.

In KiCad, open Board Setup → Design Rules → Constraints and adjust the parameters to match realistic manufacturing capabilities.
Here are the recommended starting points for this project:

Initial Design Rule Parameters
Parameter Value Notes
Minimum clearance 0.1016 mm (4 mil) Ensures manufacturability while supporting high-density routing.
Minimum track width 0.1016 mm (4 mil) Will be verified later with manufacturer specifications.
Via diameter / drill 0.4 mm / 0.2 mm Provides strong mechanical stability for signal and power vias.
Hole-to-hole clearance 0.15 mm Smaller than default but prevents mechanical overlap during drilling.
Thermal relief spoke count 1 Reduces copper area restriction in dense power zones.

Set the solder mask-to-copper clearance slightly above zero to ensure proper solder mask registration.
A clearance of 0.05 mm is a good starting point.

For vias and tracks carrying significant current, always use wider tracks and larger via diameters. This will be verified once the impedance calculations are complete.

Length Tuning and Differential Pair Settings

Because this design contains high-speed signals such as USB 3.0 and PCIe, configure KiCad’s Length Tuning and Differential Pair parameters early.

In the Board Setup → Design Rules → Differential Pairs section, enable length tuning with the following base parameters:

  • Amplitude: 0.1 mm
  • Corner style: Fillet or Chamfer
  • Differential pair skew tolerance: 0.25 mm

These values define the geometry used when KiCad adds serpentine traces to balance propagation delay across differential pairs.
They will be refined later once exact impedance and propagation delay calculations are available.

Finalizing the Setup

After setting up the physical layers, clearances, and tuning parameters, verify your configuration:

  • Save and reopen the board to confirm your layer names are updated (e.g., In1_GND, In2_PWR).
  • Review each tab under Board Setup to confirm that the copied settings match your design goals.
  • Leave the remaining color, formatting, and text settings as default unless needed for documentation.

At this stage, the PCB editor is fully configured for importing components and beginning placement.
The next step will be to bring in the schematic symbols, create the initial board outline, and then use a manufacturer’s impedance calculator to refine stack-up and routing constraints.

By taking the time to properly configure the layout editor, you ensure that all design decisions are grounded in manufacturable, high-speed-ready rules.
This careful preparation prevents costly rework and establishes a strong foundation for the LattePanda Mu Carrier PCB layout.

Ready for the next tutorial in this series? Here's the next one, or choose an alternative from the list of articles in the side bar. There's also lots of interesting article in our Blog. where you can read about off-grid communication technologies, electronics test equipment, course updates, and much more.

High-Speed PCB Design with KiCad

Learn to design a professional high-speed computer carrier board using KiCad, based on the LattePanda Mu Intel N100 compute module. You'll build a fully functional custom board that brings out USB, HDMI, Ethernet, GPIOs, and power interfaces.

Through hands-on practice, master multi-sheet schematic design, board layout, differential pair routing, and signal integrity. Learn essential concepts including stack-up configuration, impedance control, ESD protection, and grounding strategies, while using KiCad's advanced tools for hierarchical schematics and design rule verification.

Last Updated 11 months ago ago.

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